? 1N5624GP thru 1n5627gp vishay semiconductors formerly general semiconductor document number 88524 www.vishay.com 11-feb-02 1 glass passivated junction rectifiers rev. voltage 200 to 800v forward current 3.0a maximum ratings & thermal characteristics ratings at 25c ambient temperature unless otherwise specified. parameter symbol 1n5624 1n5625 1n5626 1n5627 unit *maximum repetitive peak reverse voltage v rrm 200 400 600 800 v *maximum dc blocking voltage v dc 200 400 600 800 v *maximum average forward rectified current 0.375" (9.5mm) lead length at t a = 70c i f(av) 3.0 a *peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 125 a maximum full load reverse current, full cycle average, 0.375" (9.5mm) lead length at t a = 70c i r(av) 200 a typical thermal resistance (1) r ja 20 c/w operating junction and storage temperature range t j, t stg ?65 to +175 c electrical characteristics ratings at 25c ambient temperature unless otherwise specified. *maximum instantaneous t a = 25c v f 1.0 v forward voltage at 3.0a t a = 70c 0.95 maximum reverse current t a = 25c 5.0 at rated dc blocking voltage t a = 150c i r 300 200 a typical reverse recovery time at t rr 3.0 s i f = 0.5a, i r = 1.0a, i rr = 0.25a typical junction capacitance at 4.0v, 1mhz c j 40 pf note: (1) thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, p.c.b. mounted *jedec registered values patented* 0.210 (5.3) 0.190 (4.8) dia. 0.052 (1.32) 0.048 (1.22) dia. 1.0 (25.4) min. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) min. do-201ad features plastic package has underwriters laboratories flammability classification 94v-0 high temperature metallurgically bonded construction cavity-free glass passivated junction capable of meeting environmental standards of mil-s-19500 3.0 ampere operation at t a =70 c with no thermal runaway typical i r less than 0.1 a high temperature soldering guaranteed: 350 c/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-201ad, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.04 oz., 1.12 g dimensions in inches and (millimeters) * glass-plastic encapsulation technique is covered by patent no. 3,996,602 and brazed-lead assembly by patent no. 3,930,306
1N5624GP thru 1n5627gp vishay semiconductors formerly general semiconductor www.vishay.com document number 88524 2 11-feb-02 200 100 10 1 100 10 average forward current (a) number of cycles at 60 h z 0 25 0 50 75 100 125 150 175 average forward rectified current (a) ambient temperature ( c) 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 fig. 3 ?typical instantaneous forward characteristics 020 60 40 100 80 fig. 4 ?typical reverse characteristics instantaneous reverse current ( a) percent of rated peak reverse voltage (%) 4.0 3.0 1.0 2.0 0.1 10 100 1 instantaneous forward current (a) t j = 25 c reverse voltage (v) junction capacitance (pf) 1 10 100 100 10 0.01 0.1 1 10 fig. 5 ?typical junction capacitance t j = 25 c f = 1.0mh z vsig = 50mvp-p g derating curve g forward surge current instantaneous forward voltage (v) t j = t jmax 8.3ms single half sine-wave (jedec method) pulse width = 300 s 1% duty cycle t j = 25 c 60 h z resistive or inductive load t j = 75 c t j = 125 c 0.375" (9.5mm) lead length ratings and characteristic curves (t a = 25 c unless otherwise noted)
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